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Merge tag 'thermal-v5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal control material for 5.19-rc1 from Daniel Lezcano:
- Add the new k3 j72xx bangdap driver and the corresponding bindings (Keerthy)
- Fix the missing of_node_put() in the SC iMX driver at probe timer (Miaoqian Lin)
- Fix memory leak in __thermal_cooling_device_register() when device_register()
fails by calling thermal_cooling_device_destroy_sysfs() (Yang Yingliang)
- Add sc8180x and sc8280xp compatible string in the DT bindings and lMH support
for QCom tsens driver (Bjorn Andersson)
- Fix OTP Calibration Register values conforming to the documentation on RZ/G2L
and bindings documentation for RZ/G2UL (Biju Das)
- Fix type in kerneldoc description for __thermal_bind_params (Corentin Labbe)
- Remove unneeded semi colon in libthermal and tools thermal as reported by
cocci (Jiapeng Chong)
- Fix potential NULL dereference in sr_thermal_probe() on Broadcom platform
(Zheng Yongjun)
- Add thermal library and thermal tools to encapsulate the netlink into event
based callbacks (Daniel Lezcano)
- Add change mode ops for the thermal-of sensor (Manaf Meethalavalappu
Pallikunhi)
- Fix non negative value support by preventing the value to be clamp to zero
(Stefan Wahren)
- Add compatible string and DT bindings for MSM8960 tsens driver (Dmitry
Baryshkov)
- Add hwmon support for K3 driver (Massimiliano Minella)
- Refactor and add multiple generations support for QCom ADC driver (Jishnu
Prakash)
- Use platform_get_irq_optional() to get the interrupt on RCar driver and
document Document RZ/V2L bindings (Lad Prabhakar)
* tag 'thermal-v5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (28 commits)
thermal: k3_j72xx_bandgap: Add the bandgap driver support
dt-bindings: thermal: k3-j72xx: Add VTM bindings documentation
thermal/drivers/imx_sc_thermal: Fix refcount leak in imx_sc_thermal_probe
thermal/core: Fix memory leak in __thermal_cooling_device_register()
dt-bindings: thermal: tsens: Add sc8280xp compatible
dt-bindings: thermal: lmh: Add Qualcomm sc8180x compatible
thermal/drivers/qcom/lmh: Add sc8180x compatible
thermal/drivers/rz2gl: Fix OTP Calibration Register values
dt-bindings: thermal: rzg2l-thermal: Document RZ/G2UL bindings
thermal: thermal_of: fix typo on __thermal_bind_params
tools/thermal: remove unneeded semicolon
tools/lib/thermal: remove unneeded semicolon
thermal/drivers/broadcom: Fix potential NULL dereference in sr_thermal_probe
tools/thermal: Add thermal daemon skeleton
tools/thermal: Add a temperature capture tool
tools/thermal: Add util library
tools/lib/thermal: Add a thermal library
thermal/drivers/thermal_of: Add change_mode ops support for thermal_of sensor
thermal/drivers/bcm2711: Don't clamp temperature at zero
thermal/drivers/tsens: Add compat string for the qcom,msm8960
...
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