rcx: adds support for 3D-IC extraction - #11124
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Signed-off-by: Arthur Koucher <arthurkoucher@precisioninno.com>
Signed-off-by: Arthur Koucher <arthurkoucher@precisioninno.com>
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This pull request implements 3D parasitic extraction and SPEF writing for multi-chip designs in the rcx tool, introducing a parser for inter-chip assembly rules and updating the extractor and SPEF writer to handle multiple dies and inter-chip bonds. The review feedback focuses on improving robustness, highlighting potential null pointer dereferences, missing early returns on file-open failures, unhandled stream extraction errors, and unsafe map lookups.
1) Guard the block null check instead of the always-created auxiliary extractor 2) Pass the logger to pinDirection and error on a missing boundary terminal 3) Sort interChipModel entries in BUILD Signed-off-by: Arthur Koucher <arthurkoucher@precisioninno.com>
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I'm marking this as a draft until we're done with our internal tests. |
AcKoucher
marked this pull request as draft
August 17, 2026 21:25
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Summary
Resolve #11005.
This PR adds support for parasitics extraction on 3D-IC (hierarchical) designs.
extract_parasiticsextracts each die using the extraction rules set for its technology, then extracts the inter-chip parasitics using the assembly design kit rules. Each bond between two dies is modeled as a resistor connecting the boundary terminals of the bonded bumps.write_spefwrites one SPEF file per die plus an additional file with the inter-chip parasitics.Current constraints:
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Verification
./etc/Build.sh).